E3372s-153TCPU-22.286.03.00.00 Release Notes V1.0.pdf

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Product name
E3372s
Product version
V1.0
Confidentiality level
CONFIDENTIAL
Total 7 pages
E3372s HiLink Firmware Release Notes
V1.0
Prepared by
Reviewed by
Approved by
Peng Xiaolin
Yu jianbing、Jiangqian
Date
Date
Date
2014-4-21
2014-4-21
Huawei Technologies Co., Ltd.
All rights reserved
Revision Record
Date
2014-4-21
Revision FW-WebUI/HiLink
version
Version
1.0
FW
22.286.03.00.00
Change Description
Author
Peng xiaolin
Table of Contents
1 Main Features .......................................................................................................................... 4
2 Hardware .................................................................................................................................. 4
2.1
Hardware Specifications .................................................................................................... 4
3 Firmware .................................................................................................................................. 5
3.1
Version Description ............................................................................................................ 5
3.2
3.3
Firmware Specifications ..................................................................................................... 5
Improvement in the Previous Version ................................................................................ 6
3.4
Known Limitations and Issues ........................................................................................... 6
4 WebUI/HiLink ........................................................................................................................... 6
4.1
Version Description ............................................................................................................ 6
4.2
4.3
4.4
WebUI/HiLink Specifications .............................................................................................. 6
Improvement in the Previous Version ................................................................................ 6
Known Limitations and Issues ........................................................................................... 6
E3372s HiLink Firmware Release Notes V1.0
CONFIDENTIAL
E3372s Firmware Release Notes V1.0
1 Main Features
The E3372s supports the following standards:
LTE data service up to 150Mbit/s(Downlink) and 50Mbit/s(Uplink)
DC-HSPA+ data service up to 43.2 Mbit/s
HSPA+ data service up to 21.6 Mbit/s
HSDPA packet data service of up to 14.4 Mbit/s
HSUPA data service up to 5.76 Mbit/s
WCDMA PS domain data service of up to 384 Kbit/s
Equalizer and receive diversity
microSD Card Slot (Up to 32G)
Data and SMS Service
HiLink features (Driverless, WEB UI, Auto connect)
Plug and play
Standard USB interface
2 Hardware
2.1
Hardware Specifications
Item
Hardware Version
Technical standard
Specifications
CL1E3372SM
LTE 3GPP R9
HSPA+/UMTS: 3GPP R99/R5/R6/R7/R8
GSM/GPRS/EDGE: 3GPP R99
USB: Type A with standard USB 2.0 High speed interface
LED: indicating the status of the Data Card
External interfaces
SD card: standard TF card interface
SIM/USIM card: standard 6-pin SIM card interface
RF interface: external RF interface
Maximum power
consumption
Power supply
Dimensions (D × W × H)
Weight
3.5 W
5V
About 92mm(D) × 32mm(W) × 14mm (H)
50 g
Page 4
E3372s HiLink Firmware Release Notes V1.0
CONFIDENTIAL
Item
Temperature
Humidity
Specifications
Operating: –10℃ to +40℃
Storage: –20℃ to +70℃
5% to 95%
Plug and play (PnP)
Standard USB 2.0 High Speed
convenient for use
interface, auto installation,
Base Information
Note:
3GPP = The 3rd Generation Partnership Project
TS = Technical Specification
LED = Light-Emitting Diode
SIM = Subscriber Identity Module
USIM = UMTS Subscriber Identity Module
3 Firmware
3.1
Version Description
Firmware Version:
Baseline information
22.286.03.00.00
Balong V7R2 C30B286
3.2
Firmware Specifications
Firmware
Item
Specifications
22.286.03.00.00
Platform
Balong V7R2
B286
LTE Supported
Version
Information
Baseline
Feature
GSM CS domain
GPRS
EDGE
UMTS PS domain
HSDPA
HSUPA
Uplink: 9.6/14.4 kbit/s
Downlink: 9.6/14.4 kbit/s
Uplink: 85.6 kbit/s
Downlink: 85.6 kbit/s
Uplink: 236.8 kbit/s
Downlink: 236.8 kbit/s
Uplink: 384 kbit/s
Downlink: 384 kbit/s
14.4Mbit/s
5.76 Mbit/s
Page 5
Data service

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